India, March 12 -- NVIDIA's next-generation AI compute rack architecture indicates that future GPU designs will increasingly prioritize higher chip-to-chip interconnect density and faster data transmission, according to TrendForce's latest research on the high-speed interconnect market. Intra-rack chip interconnects (scale-up) and large-scale interconnects across racks (scale-out) will become central considerations in data center design as AI clusters continue to scale.

Traditional electrical transmission using copper cables faces physical limitations and will struggle to support the massive data movement required by next-generation AI infrastructure. As a result, optical transmission technologies are gaining greater importance.

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