India, Oct. 12 -- Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has introduced the ASYMTEK Vantage XL fluid dispensing platform, designed specifically to address the demanding requirements of panel-level packaging (PLP) and other advanced semiconductor packaging applications.

The ASYMTEK Vantage XL extends Nordson's proven Vantage dispensing platform to larger panel formats, enabling manufacturers to develop next-generation advanced packaging processes and scale production with greater accuracy, throughput, and process control.

Panel-level packaging (PLP) enables higher throughput and lower manufacturing costs compared to wafer-level operations, especially as package sizes grow and th...