Micron advances memory innovation with world's first ultra-dense module for next-gen servers
India, Sept. 18 -- Micron Technology Inc. has announced a major milestone in memory innovation with the successful demonstration of the world's first 512GB DDR5 module on multiple server platforms.
The achievement reinforces Micron's leadership in high-performance, high-capacity server memory and provides enterprise data center and cloud customers with a path to support large and demanding AI, analytics, in-memory database and simulation-heavy workloads with greater efficiency. Leading semiconductor enablers, AMD and Intel, are both actively validating the module, which will deliver speeds up to 9,200 MT/s.
The module's high capacity is possible due to Micron's advanced vertical interconnect packaging innovations. This product verticall...
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