India, July 18 -- As semiconductor packaging technologies evolve, 2.5D packaging and 3D Cu-Cu hybrid bonding are becoming essential routes to higher performance and improved power efficiency. However, manufacturing these packages at high yield requires careful material selection, process control, and continued innovation in packaging manufacturing techniques.

IDTechEx's latest report, "Materials and Processing for Advanced Semiconductor Packaging 2027-2037: Technologies, Players, Forecasts," examines these challenges across 2.5D packaging materials and process flows, including silicon, organic-based materials, and glass, as well as Cu-Cu hybrid bonding for 3D integration.

The report also provides 10-year forecasts for organic dielectric...