India, Aug. 26 -- Manz Asia, a leading provider of semiconductor advanced packaging equipment and process solutions, has pioneered production-proven ECD (electrochemical deposition) platforms supporting 310 mm, 510 mm, and 700 mm panel formats.

Building on ECD as a core technology, Manz Asia integrates key wet process tools-including cleaning, developing, etching, and stripping-into the Omni 310, Omni 510, and Omni 700 platforms to enable scalable panel-level RDL manufacturing.

Extending RDL Process Value from Established Applications to Next-Generation Advanced Packaging

As AI and advanced computing drive increasingly complex chiplet-based architectures, larger interposers and substrates are becoming essential to integrate more hetero...