India, Aug. 19 -- According to TrendForce's latest AI server industry research, continued investment in AI infrastructure and the rapid iteration of AI chips from NVIDIA, AMD, and Google have pushed the TDP of individual chips above 1 kW. Meanwhile, rack-scale AI server solutions now consume hundreds of kilowatts. As a result, liquid cooling is increasingly becoming standard for high-end AI infrastructure.

TrendForce projects liquid cooling penetration among AI chips to reach 53% in 2026 and approach 60% in 2027.

High-end chips from NVIDIA, AMD, and Google drive liquid cooling demand

TrendForce notes that accelerated AI investment by Tier 2 data center operators and growing demand from Chinese CSPs for overseas AI projects are expected...