India, July 18 -- Leading semiconductor research institute imec has unveiled its latest process roadmap, signaling a major shift in the evolution of advanced chips. According to TechNews, citing Tom's Hardware, the roadmap suggests that traditional transistor scaling will no longer be the sole driver of chip density as contacted poly pitch (CPP) approaches its practical limits.

imec forecasts that semiconductor technology will advance to the A3 (0.3nm) generation by 2038. However, after the A10 (~1nm) generation, expected around 2030, further scaling of CPP is expected to face fundamental limitations, meaning future gains in chip density will increasingly depend on reducing standard cell height alongside new device architectures and adva...