India, Oct. 6 -- IC-Link by imec, imec's design and manufacturing service provider for ASICs and silicon photonics, and TSMC have announced an expansion of their collaboration aimed at simplifying customer access to advanced-node semiconductor design capabilities.

As the newest member of the TSMC Open Innovation Platform (OIP) Cloud Alliance, IC-Link will become the first managed-cloud service supporting mixed-partner EDA flow for silicon design. With its cloud offering, IC-Link combines advanced-node technology access, secure cloud-based design capabilities and expert support to help innovators accelerate the path from concept to silicon.

As semiconductor development becomes increasingly complex, design teams face growing pressures rel...