India, April 21 -- In a defining moment for India's semiconductor ambitions and Odisha's emergence as a future-ready technology destination, the foundation stone for the country's first advanced 3D chip packaging unit was laid at Info Valley, Bhubaneswar.

The project marks a significant step towards strengthening India's domestic semiconductor ecosystem and advancing the vision of Atmanirbhar Bharat in high-end electronics manufacturing.

The foundation stone of the Heterogeneous Integration Packaging Solutions project, promoted by 3D Glass Solutions, was laid in the presence of Chief Minister Mohan Charan Majhi, and Union Minister for Railways, Electronics & Information Technology, and Information & Broadcasting Ashwini Vaishnaw. With t...