India, Aug. 3 -- India has adopted a multi-pronged roadmap to build a robust semiconductor talent pipeline as a part of Semicon India Program, more recently, Semicon 2.0.

The objective is to create a workforce capable of supporting the entire semiconductor value chain from chip design and fabrication to assembly, testing, marking and packaging (ATMP).

Curriculum development and infrastructure provisioning

One of the important focuses of the government has been to integrate semiconductor education curriculum in engineering institutes and colleges. To advance this government has taken following initiatives:

Semiconductor fabrication and ATMP skilling

Similarly, in the area of semiconductor fabrication and ATPM/OSAT, the government has ...