India, April 9 -- Global Electronics Association has released IPC-6921, Requirements and Acceptance for Organic IC Substrates, a new international standard establishing clear qualification, performance, and acceptance criteria for organic IC substrates.

Developed by a global task group of experts from North America, Europe, China, Korea, and Japan across the IC substrate value chain, IPC-6921 delivers a unified, internationally referenceable technical framework for advanced packaging. The standard addresses both wire-bond and flip-chip substrates, with clearly defined requirements across design, manufacturing, quality control, and reliability.

IPC-6921 also includes extensive visual acceptance criteria, with photographic examples illust...