India, Oct. 6 -- Global Electronics Association has signed a Memorandum of Understanding (MoU) with the Fraunhofer Group for Microelectronics to help accelerate the path from advanced packaging innovation to industry-scale manufacturing.

The collaboration focuses on the APECS pilot line, the European pilot line for advanced packaging and heterogeneous integration for electronics components and systems under the EU Chips Act. APECS is coordinated by the Fraunhofer-Gesellschaft and implemented by Research Fab Microelectronics Germany (FMD), a research collaboration of 13 Fraunhofer institutes and the Leibniz institutes FBH and IHP.

The MoU draws on APECS pilot line capabilities and the Global Electronics Association's expertise in standar...