India, April 20 -- Artificial intelligence (AI) is driving unprecedented growth in computing power and data movement. However, memory and interconnect bandwidth are struggling to keep pace, creating major challenges for hyperscale data centers in terms of power consumption, latency, and system complexity.

Co-packaged optics (CPO) is emerging as a transformative solution. By integrating optical engines closer to switch ASICs and GPUs through advanced packaging approaches such as 2.5D and 3D integration, CPO enables higher bandwidth density and improved energy efficiency.

This technological shift is reshaping the photonics ecosystem, with major industry players such as NVIDIA, Broadcom, TSMC, and ASE actively developing new architectures ...