India, April 3 -- Since the start of 2026, sustained demand from AI and high-performance computing (HPC) has kept the global semiconductor equipment financing highly active.

In China, under the push for supply chain self-reliance, localization is accelerating across high-end bonding tools, automated test equipment (ATE), and wide bandgap semiconductor material equipment. Overseas, disruptive lithography technologies are gaining traction.

iSABers raises ~CNY 500 million in strategic financing led by AMEC

iSABers has recently completed a strategic financing round of approximately CNY 500 million. The round was co-led by Advanced Micro-Fabrication Equipment Inc. (AMEC) and Fortera Capital, with participation from BAIC Capital and continue...