India, June 3 -- CEA-Leti has announced a major milestone in the evolution of 3D integration for high-performance computing (HPC), advanced smart-vision systems and artificial intelligence (AI), demonstrating a functional test vehicle utilizing die-to-wafer (D2W) hybrid bonding with pitches down to 1 μm. The findings were presented at the Electronic Components and Technology Conference (ECTC) 2026.

As Moore's Law reaches physical limits, the semiconductor industry is increasingly relying on 3D stacking to enhance performance and energy efficiency. This D2W technology addresses a critical bottleneck in AI accelerator design: interconnect density and bandwidth. By vertically stacking device layers with ultra-fine pitches, the technolo...