Cadence intros AuraStack AI Super Agent -- world's first Agentic AI platform for PCB and advanced packaging
India, July 18 -- Cadence has introduced the AuraStack AI Super Agent on Cadence Allegro AI Studio, the world's first agentic AI platform for printed circuit board (PCB) and advanced packaging design, taking designers from system planning to final product in a single AI-native environment.
The Cadence AuraStack AI Super Agent, accelerated by NVIDIA Blackwell and NVIDIA CUDA-X, coordinates domain-specific AI agents across planning, implementation, and tightly integrated multiphysics analysis domains to compress the system-design cycle through manufacturing.
With the AuraStack AI Super Agent, Cadence is now the only provider with agentic AI solutions spanning the full electronic system design flow, from digital and analog silicon design, ...
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