India, June 23 -- Applied Materials Inc. has introduced two new chipmaking systems designed to solve an emerging challenge in leading-edge semiconductor manufacturing: achieving precision processing in increasingly deep and narrow 3D structures.

The new deposition and etch systems help chipmakers extend scaling in logic and memory to deliver higher performance, improved energy efficiency, and better manufacturing yield for next-generation AI chips.

The surge in AI compute is accelerating the industry's transition to advanced 3D device architectures, including gate-all-around (GAA) transistors and high-layer-count 3D NAND. As features become deeper and narrower in these vertical structures, conventional deposition and etch processes str...