India, June 29 -- Applied Materials Inc. has introduced a suite of new chipmaking systems for building the advanced 3D chip architectures that power next-generation AI.

AI compute is increasingly constrained by memory, as model scale and data movement demands outpace gains in bandwidth, capacity and energy efficiency. This growing "memory wall" is accelerating adoption of advanced packaging architectures, including high bandwidth memory (HBM) and 3D stacking.

These technologies deliver step-change improvements in bandwidth and efficiency but introduce new challenges in process complexity. Applied is enabling this transition with a materials engineering portfolio spanning advanced packaging, process control and DRAM, extending its leade...