India, May 5 -- Applied Materials Inc. has entered into a definitive agreement with ASMPT Ltd to acquire its NEXX business, a leading supplier of large-area advanced packaging deposition equipment for the semiconductor industry.

The addition of the NEXX team and products will broaden Applied's portfolio of panel-level advanced packaging technologies which are designed to enable chipmakers and systems companies to build larger-body AI accelerators for higher energy-efficient performance.

Increasing AI workloads demand larger chiplet-based designs that integrate greater numbers of GPUs, high-bandwidth memory (HBM) stacks and input-output (I/O) chips in a single, advanced package. As AI chip packages scale to more complex architectures lik...