India, May 21 -- Applied Materials Inc. announced that Broadcom Inc. will join Applied's EPIC platform as an innovation partner to accelerate development of advanced chip packaging technologies critical to next-generation AI systems.

The explosive growth of AI has driven a surge in demand for high-performance, energy-efficient compute infrastructure. To address this demand, chipmakers and system designers are increasingly adopting advanced packaging techniques and heterogeneous integration of multiple chips, aiming to boost energy-efficient performance across their systems. To unlock AI's full potential, the industry is developing a new set of packaging building blocks to dramatically increase the interconnect density and bandwidth of to...