India, March 18 -- Applied Materials, Inc. announced a long-term collaboration agreement with SK hynix Inc. to accelerate the development and deployment of next-generation DRAM and high-bandwidth memory (HBM) essential for AI and high-performance computing.

Engineers from both companies will work side-by-side at Applied's EPIC Center in Silicon Valley to advance innovation in materials, process integration and 3D advanced packaging as memory architectures move beyond current production nodes.

"Applied Materials and SK hynix share a long history of working together to improve the energy-efficient performance of advanced memory chips through innovations in materials engineering," said Gary Dickerson, President and CEO of Applied Materials...