India, Oct. 8 -- Applied Materials Inc. is working with Intel Corp. to accelerate development of chipmaking innovations for next-generation transistors, interconnects and advanced packaging technologies.

The collaboration will bring together cutting-edge capabilities from Applied's EPIC Center in Silicon Valley and Intel's R&D campus in Hillsboro, Oregon to shorten time-to-market of advanced semiconductor technologies essential to AI computing.

"Applied and Intel share a decades-long history of deep collaboration focused on pushing the boundaries of materials engineering to advance the semiconductor roadmap," said Gary Dickerson, President and CEO of Applied Materials. "Bringing our teams together at the EPIC Center will deepen that par...