India, May 7 -- TrendForce's latest foundry industry findings point out that AI demand has surged rapidly since 2023, leading to capacity bottlenecks in 3nm-2nm wafers, and 2.5D/3D advanced packaging. The shortage of CoWoS has persisted, extending upstream to production equipment and downstream to substrates, packaging materials, and other critical components.

On the front-end, 3nm advanced process capacity-currently dominated by TSMC-has become even more constrained, turning into a scarce resource fiercely contested by global tech giants.

TrendForce notes that the resource competition triggered by AI has spread across the entire semiconductor supply chain. Industry leader NVIDIA, leveraging its experience and strong supply chain contro...