India, July 10 -- ACM Research has introduced Ultra C Tahoe advanced cleaning tool that meets the demanding technical requirements of advanced nodes for foundry, logic and memory applications.

The tool delivers the performance of standalone single-wafer cleaning tools on low-to-medium temperature sulfuric peroxide mix (SPM) processes. Tahoe's patented hybrid architecture is among the first in the industry to combine batch wafer processing and single wafer cleaning chambers into the same SPM tool.

The hybrid architecture delivers enhanced cleaning performance, high throughput, and process flexibility, with up to 75% reduction in chemical consumption.

High-performance, eco-friendly SPM cleaning technology

"Ultra C" stands for "ultra-cle...