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US Patent Issued to SAMSUNG ELECTRONICS on Oct. 27 for "Stack-type semiconductor package with improved operating stability" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,979, issued on Oct. 27, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Stack-type semiconductor package with improv... Read More


US Patent Issued to MURATA MANUFACTURING on Oct. 27 for "High frequency module and communication device" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,980, issued on Oct. 27, was assigned to MURATA MANUFACTURING Co. LTD. (Nagaokakyo, Japan). "High frequency module and communication device"... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Oct. 27 for "Ring structure surrounding a package component" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,981, issued on Oct. 27, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Ring structure surrounding a pa... Read More


US Patent Issued to Avago Technologies International Sales on Oct. 27 for "Systems and methods for connecting integrated circuits" (California Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,982, issued on Oct. 27, was assigned to Avago Technologies International Sales Pte. Ltd. (Singapore). "Systems and methods for connecting i... Read More


US Patent Issued to Hefei BOE Ruisheng Technology, Beijing BOE Technology Development on Oct. 27 for "Light-emitting substrate and manufacturing method therefor, backlight module, and display apparatus" (Chinese Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,983, issued on Oct. 27, was assigned to Hefei BOE Ruisheng Technology Co. Ltd. (Anhui, China) and Beijing BOE Technology Development Co. Ltd... Read More


US Patent Issued to Taiwan Semiconductor Manufacturing on Oct. 27 for "Photonic semiconductor device and method of manufacture" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,984, issued on Oct. 27, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Photonic semiconductor device and m... Read More


US Patent Issued to SAMSUNG ELECTRONICS on Oct. 27 for "Semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,985, issued on Oct. 27, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package" was invented by Jihyu... Read More


US Patent Issued to QUALCOMM on Oct. 27 for "Integrated circuit device having a substrate with a stepped configuration to accommodate at least two different solder ball sizes" (California Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,986, issued on Oct. 27, was assigned to QUALCOMM Inc. (San Diego). "Integrated circuit device having a substrate with a stepped configurati... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Oct. 27 for "Semiconductor device having planar transistor and FinFET" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,706, issued on Oct. 27, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD. (Hsinchu, Taiwan). "Semiconductor device having planar ... Read More


US Patent Issued to WAVEFRONT HOLDINGS on Oct. 27 for "High-bandgap(EG) structure in planar floating-base bipolar phototransistor (PT)" (New Jersey Inventor)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,707, issued on Oct. 27, was assigned to WAVEFRONT HOLDINGS LLC (Basking Ridge, N.J.). "High-bandgap(EG) structure in planar floating-base b... Read More