US Patent Issued to SAMSUNG ELECTRONICS on Oct. 27 for "Stack-type semiconductor package with improved operating stability" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,979, issued on Oct. 27, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Stack-type semiconductor package with improved operating stability" was invented by Minki Kim (Suwon-si, South Korea), Raeyoung Kang (Suwon-si, South Korea), Jihoon Kim (Suwon-si, South Korea), Jinkyeong Seol (Suwon-si, South Korea) and Hyuekjae Lee (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first die having signal and dummy regions, and a second die on the first die. The first die includes first dummy patterns arranged in a first direction on the dummy region, second dummy patterns on the dummy...