US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Oct. 27 for "Ring structure surrounding a package component" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,981, issued on Oct. 27, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Ring structure surrounding a package component" was invented by Chin-Hua Wang (New Taipei City, Taiwan), Shu-Shen Yeh (Taoyuan City, Taiwan), Po-Chen Lai (Hsinchu County, Taiwan), Po-Yao Lin (Zhudong Township, Hsinchu County, Taiwan) and Shin-Puu Jeng (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure is provided. The package structure includes a first package component and a second package component. The second package component includes a substrate and the first package component is mounted to the substrate. ...