ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,929, issued on Oct. 27, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan). "Semiconductor device" was invented by Shinichi Masuda (M... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,930, issued on Oct. 27. "Flexible thermal interface based on self-assembled boron arsenide for high-performance thermal management" was inv... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,931, issued on Oct. 27, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Chip-on-film package" was invented by Minwoo... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,932, issued on Oct. 27, was assigned to Sony Group Corp. (Tokyo) and Sony Semiconductor Solutions Corp. (Kanagawa, Japan). "Cooling mechani... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,933, issued on Oct. 27, was assigned to ABACO SYSTEMS INC. (Huntsville, Ala.). "Impingement cooling providing enhanced localized cooling of... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,934, issued on Oct. 27, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Through via with guard ring str... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,935, issued on Oct. 27, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor device and method of manufactu... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,936, issued on Oct. 27, was assigned to SK hynix Inc. (Icheon-si, South Korea). "Stack package including insert die for reinforcement" was ... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,937, issued on Oct. 27, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor packages" was invented by Tae-... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,938, issued on Oct. 27, was assigned to Renesas Electronics Corp. (Tokyo). "Semiconductor device" was invented by Yuki Yamamoto (Tokyo) and... Read More