US Patent Issued on Oct. 27 for "Flexible thermal interface based on self-assembled boron arsenide for high-performance thermal management" (California Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,930, issued on Oct. 27.

"Flexible thermal interface based on self-assembled boron arsenide for high-performance thermal management" was invented by Yongjie Hu (Los Angeles) and Ying Cui (Los Angeles).

According to the abstract* released by the U.S. Patent & Trademark Office: "A thermal interface comprising a polymer composite comprising a polymer and a self-assembled boron arsenide."

The patent was filed on Feb. 4, 2022, under Application No. 18/264,571.

*For further information, including images, charts and tables, please visit: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=12777930&O...