Exclusive

Publication

Byline

Location

US Patent Issued to ABSOLICS on June 30 for "Substrate comprising a lid structure, package substrate comprising the same and semiconductor device" (South Korean, American Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,541, issued on June 30, was assigned to ABSOLICS INC.. "Substrate comprising a lid structure, package substrate comprising the same and sem... Read More


US Patent Issued to STATS ChipPAC on June 30 for "Semiconductor device and method of controlling distribution of liquid metal TIM using lid structure" (South Korean Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,542, issued on June 30, was assigned to STATS ChipPAC Pte. Ltd. (Singapore). "Semiconductor device and method of controlling distribution o... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on June 30 for "Integrated circuit packages and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,543, issued on June 30, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD. (Hsinchu, Taiwan). "Integrated circuit packages and met... Read More


US Patent Issued to ROHM on June 30 for "Semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,544, issued on June 30, was assigned to ROHM Co. LTD. (Kyoto, Japan). "Semiconductor device" was invented by Daichi Niwa (Kyoto, Japan) and... Read More


US Patent Issued to Micron Technology on June 30 for "Apparatuses and methods including structures in scribe regions of semiconductor devices" (Japanese Inventor)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,545, issued on June 30, was assigned to Micron Technology Inc. (Boise, Idaho). "Apparatuses and methods including structures in scribe regi... Read More


US Patent Issued to SILICONWARE PRECISION INDUSTRIES on June 30 for "Electronic package and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,547, issued on June 30, was assigned to SILICONWARE PRECISION INDUSTRIES Co. LTD. (Taichung City, Taiwan). "Electronic package and manufact... Read More


US Patent Issued to KIOXIA on June 30 for "Semiconductor device and method of producing the same" (Japanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,548, issued on June 30, was assigned to KIOXIA Corp. (Tokyo). "Semiconductor device and method of producing the same" was invented by Toshi... Read More


US Patent Issued to Taiwan Semiconductor Manufacturing on June 30 for "Light sensor for package intrusion detection" (Taiwanese Inventor)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,549, issued on June 30, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Light sensor for package intrusion ... Read More


US Patent Issued to AUO on June 30 for "Package structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,550, issued on June 30, was assigned to AUO Corp. (Hsin-Chu, Taiwan). "Package structure and manufacturing method thereof" was invented by ... Read More


US Patent Issued to Allegro MicroSystems on June 30 for "Transformer-based isolator with sense coil" (Irish Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,551, issued on June 30, was assigned to Allegro MicroSystems LLC (Manchester, N.H.). "Transformer-based isolator with sense coil" was inven... Read More