US Patent Issued to STATS ChipPAC on June 30 for "Semiconductor device and method of controlling distribution of liquid metal TIM using lid structure" (South Korean Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,542, issued on June 30, was assigned to STATS ChipPAC Pte. Ltd. (Singapore).

"Semiconductor device and method of controlling distribution of liquid metal TIM using lid structure" was invented by JongChan Park (Incheon, South Korea), YoungMin Kim (Incheon, South Korea) and TaeKeun Lee (Incheon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device has an electrical component and a heat sink disposed over the electrical component. The heat sink has a cover with a wall extending from the cover forming a pocket around a perimeter of the electrical component. The heat sink also has a horizontal step, and a riser extending from...