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US Patent Issued to SK hynix on Aug. 4 for "Semiconductor device and method for fabricating the same" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,690, issued on Aug. 4, was assigned to SK hynix Inc. (Gyeonggi-do, South Korea). "Semiconductor device and method for fabricating the same" ... Read More


US Patent Issued to SK hynix on Aug. 4 for "Semiconductor device and method for fabricating the same" (South Korean Inventor)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,691, issued on Aug. 4, was assigned to SK hynix Inc. (Gyeonggi-do, South Korea). "Semiconductor device and method for fabricating the same" ... Read More


US Patent Issued to Changxin Memory Technologies on Aug. 4 for "Semiconductor structure and forming method and operating method therefor" (Chinese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,692, issued on Aug. 4, was assigned to Changxin Memory Technologies Inc. (Hefei, China). "Semiconductor structure and forming method and ope... Read More


US Patent Issued to Kioxia on Aug. 4 for "Oxide semiconductor device and oxide semiconductor memory device" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,693, issued on Aug. 4, was assigned to Kioxia Corp. (Tokyo). "Oxide semiconductor device and oxide semiconductor memory device" was invented... Read More


US Patent Issued to Micron Technology on Aug. 4 for "Apparatuses including semiconductive pillar structures, and related methods, memory devices, and electronic systems" (Japanese Inventor)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,694, issued on Aug. 4, was assigned to Micron Technology Inc. (Boise, Idaho). "Apparatuses including semiconductive pillar structures, and r... Read More


US Patent Issued to Micron Technology on Aug. 4 for "Memory device including structures in memory array region and periperal circuitry region" (Idaho Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,695, issued on Aug. 4, was assigned to Micron Technology Inc. (Boise, Idaho). "Memory device including structures in memory array region and... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 4 for "Integrated circuit device, memory device, and method of manufacturing" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,697, issued on Aug. 4, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Integrated circuit device, memory... Read More


US Patent Issued to YANGTZE MEMORY TECHNOLOGIES on Aug. 4 for "3D memory device, measurement method thereof, and film measurement device" (Chinese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,698, issued on Aug. 4, was assigned to YANGTZE MEMORY TECHNOLOGIES Co. LTD. (Wuhan, China). "3D memory device, measurement method thereof, a... Read More


US Patent Issued to SAMSUNG ELECTRONICS on Aug. 4 for "Semiconductor memory device and electronic system including the same" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,699, issued on Aug. 4, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor memory device and electronic sys... Read More


US Patent Issued to YANGTZE MEMORY TECHNOLOGIES on Aug. 4 for "Three-dimensional memory devices and methods for forming the same" (Chinese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,700, issued on Aug. 4, was assigned to YANGTZE MEMORY TECHNOLOGIES Co. LTD. (Wuhan, China). "Three-dimensional memory devices and methods fo... Read More