ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,650, issued on Aug. 4, was assigned to Particle Beam Lasers Inc. (Waxahachie, Texas). "Low energy electron-cooling system and method" was in... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,651, issued on Aug. 4, was assigned to Mellanox Technologies Ltd. (Yokneam, Israel). "Efficient thermal management for vertical power delive... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,652, issued on Aug. 4, was assigned to HongQiSheng Precision Electronics (QinHuang Dao) Co. Ltd. (Qinhuangdao, China), Avary Holding (Shenzhe... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,653, issued on Aug. 4, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea). "Printed circuit board" was invented by J... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,654, issued on Aug. 4, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea). "Circuit board and manufacturing method t... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,655, issued on Aug. 4, was assigned to TAIYO HOLDINGS Co. LTD. (Hiki-gun, Japan). "Structure body and wiring board" was invented by Shoya Se... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,656, issued on Aug. 4, was assigned to LG Energy Solution Ltd. (Seoul, South Korea). "Printed circuit board, manufacturing method thereof, a... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,657, issued on Aug. 4, was assigned to Medtronic Inc. (Minneapolis). "Electrical component and method of forming same" was invented by Chunh... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,658, issued on Aug. 4, was assigned to IBIDEN Co. Ltd. (Ogaki, Japan). "Wiring substrate" was invented by Masashi Kuwabara (Ibi-gun, Japan) ... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,659, issued on Aug. 4, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Circuit board module and method for manufactur... Read More