US Patent Issued to LG Energy Solution on Aug. 4 for "Printed circuit board, manufacturing method thereof, and battery pack including the same" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,656, issued on Aug. 4, was assigned to LG Energy Solution Ltd. (Seoul, South Korea).

"Printed circuit board, manufacturing method thereof, and battery pack including the same" was invented by Jae Young Jang (Daejeon, South Korea), Jin Hyun Lee (Daejeon, South Korea) and Min Su Son (Daejeon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A printed circuit board includes an inner layer; a first insulating layer formed on an upper part of the inner layer; a first copper foil layer formed on an upper part of the first insulating layer; and a solder resist layer formed on an upper part of the first copper foil layer. When welding a metal tab o...