ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,654, issued on Aug. 4, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).
"Circuit board and manufacturing method thereof" was invented by Kyehwan Lee (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A circuit board includes: an insulating layer, a solder resist layer disposed on the insulating layer and having first and second openings; first and second connection pads respectively disposed within the first and second openings on the insulating layer; and first and second conductive layers respectively disposed on the first and second connection pads, and configured to protrude more than an upper surface...