US Patent Issued to STATS ChipPAC on Aug. 11 for "Semiconductor device and method of die attach with adhesive layer containing graphene-coated core" (South Korean Inventors)

Posted On: 2026-08-12

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,038, issued on Aug. 11, was assigned to STATS ChipPAC Pte. Ltd. (Singapore). "Semiconductor device and method of die attach with adhesive l... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 11 for "Method of manufacturing 3DIC package comprising a plurality of discrete device dies bonding to a wafer" (Taiwanese Inventors)

Posted On: 2026-08-12

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ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,039, issued on Aug. 11, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Method of manufacturing 3DIC packag... Read More

US Patent Issued to CHANGXIN MEMORY TECHNOLOGIES on Aug. 11 for "Semiconductor package structure and method for fabricating the same" (Chinese Inventor)

Posted On: 2026-08-12

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ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,040, issued on Aug. 11, was assigned to CHANGXIN MEMORY TECHNOLOGIES INC. (Hefei City, China). "Semiconductor package structure and method ... Read More

US Patent Issued to SAMSUNG ELECTRONICS on Aug. 11 for "Semiconductor package having a first package structure including a first redistribution structure and a second package structure including a second redistribution structure" (South Korean Inventors)

Posted On: 2026-08-12

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ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,041, issued on Aug. 11, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package having a first package... Read More

US Patent Issued to Micron Technology on Aug. 11 for "Semiconductor device with volumetrically-expanded side-connected interconnects" (Idaho Inventor)

Posted On: 2026-08-12

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ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,042, issued on Aug. 11, was assigned to Micron Technology Inc. (Boise, Idaho). "Semiconductor device with volumetrically-expanded side-conn... Read More

US Patent Issued to ROHM on Aug. 11 for "Semiconductor device with wire including a surface metal layer covering a core metal" (Japanese Inventors)

Posted On: 2026-08-12

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ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,043, issued on Aug. 11, was assigned to ROHM Co. LTD. (Kyoto, Japan). "Semiconductor device with wire including a surface metal layer cover... Read More

US Patent Issued to SK hynix on Aug. 11 for "Memory stack structure including power distribution structures and a high-bandwidth memory including the memory stack structure" (South Korean Inventors)

Posted On: 2026-08-12

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ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,044, issued on Aug. 11, was assigned to SK hynix Inc. (Icheon-si, South Korea). "Memory stack structure including power distribution struct... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 11 for "Method and structure for a three-dimensional package" (Taiwanese Inventors)

Posted On: 2026-08-12

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ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,045, issued on Aug. 11, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Method and structure for a three-di... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 11 for "Semiconductor device including cross-die bonding ring and methods for forming the same" (Taiwanese Inventors)

Posted On: 2026-08-12

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ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,046, issued on Aug. 11, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor device including cros... Read More

US Patent Issued to Infineon Technologies Austria on Aug. 11 for "Power semiconductor package and method for fabricating the same" (German, Austrian Inventors)

Posted On: 2026-08-12

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ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,047, issued on Aug. 11, was assigned to Infineon Technologies Austria AG (Villach, Austria). "Power semiconductor package and method for fa... Read More

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US Patent Issued to STATS ChipPAC on Aug. 11 for "Semiconductor device and method of die attach with adhesive layer containing graphene-coated core" (South Korean Inventors)

US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 11 for "Method of manufacturing 3DIC package comprising a plurality of discrete device dies bonding to a wafer" (Taiwanese Inventors)

US Patent Issued to CHANGXIN MEMORY TECHNOLOGIES on Aug. 11 for "Semiconductor package structure and method for fabricating the same" (Chinese Inventor)

US Patent Issued to SAMSUNG ELECTRONICS on Aug. 11 for "Semiconductor package having a first package structure including a first redistribution structure and a second package structure including a second redistribution structure" (South Korean Inventors)

US Patent Issued to Micron Technology on Aug. 11 for "Semiconductor device with volumetrically-expanded side-connected interconnects" (Idaho Inventor)

US Patent Issued to ROHM on Aug. 11 for "Semiconductor device with wire including a surface metal layer covering a core metal" (Japanese Inventors)

US Patent Issued to SK hynix on Aug. 11 for "Memory stack structure including power distribution structures and a high-bandwidth memory including the memory stack structure" (South Korean Inventors)

US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 11 for "Method and structure for a three-dimensional package" (Taiwanese Inventors)

US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 11 for "Semiconductor device including cross-die bonding ring and methods for forming the same" (Taiwanese Inventors)

US Patent Issued to Infineon Technologies Austria on Aug. 11 for "Power semiconductor package and method for fabricating the same" (German, Austrian Inventors)