US Patent Issued to STATS ChipPAC on Aug. 11 for "Semiconductor device and method of die attach with adhesive layer containing graphene-coated core" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,038, issued on Aug. 11, was assigned to STATS ChipPAC Pte. Ltd. (Singapore).

"Semiconductor device and method of die attach with adhesive layer containing graphene-coated core" was invented by YongMoo Shin (Incheon, South Korea), HeeSoo Lee (Incheon, South Korea) and SuJeong Kwon (Incheon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device has a substrate and an adhesive layer with a graphene core shell deposited over a surface of the substrate. An electrical component is affixed to the substrate with the adhesive layer. A bond wire is connected between the electrical component and substrate. The graphene core shell ha...