US Patent Issued to Micron Technology on Aug. 11 for "Semiconductor device with volumetrically-expanded side-connected interconnects" (Idaho Inventor)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,042, issued on Aug. 11, was assigned to Micron Technology Inc. (Boise, Idaho).

"Semiconductor device with volumetrically-expanded side-connected interconnects" was invented by Kyle K. Kirby (Eagle, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device assembly is described that includes two semiconductor dies. The semiconductor dies each include a layer of dielectric material and a reservoir of conductive material located adjacent to openings in the layer of dielectric material. The opening at the layer of dielectric material of the first semiconductor die and the opening at the layer of dielectric material of the second semico...