ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,538, issued on Sept. 8, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Die stacking structure, semiconduct... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,539, issued on Sept. 8, was assigned to MITSUBISHI ELECTRIC Corp. (Tokyo). "Semiconductor device and power converter" was invented by Kohei... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,540, issued on Sept. 8, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Integrated circuit packages, device... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,541, issued on Sept. 8, was assigned to Samsung Display Co. Ltd. (Yongin-si, South Korea). "Display device and method for manufacturing dis... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,542, issued on Sept. 8, was assigned to QUALCOMM Inc. (San Diego). "Three-dimensional (3D) integrated circuit (IC) (3DIC) package employing... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,543, issued on Sept. 8, was assigned to Hitachi Energy Switzerland AG (Baden, Switzerland). "Power semiconductor module and manufacturing m... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,544, issued on Sept. 8, was assigned to Seoul Viosys Co. Ltd. (Gyeonggi-do, South Korea). "Light emitting module including light emitter wi... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,545, issued on Sept. 8, was assigned to CHANGXIN MEMORY TECHNOLOGIES INC. (Hefei City, China). "Semiconductor package structure and manufac... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,546, issued on Sept. 8, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package and method of manufact... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,547, issued on Sept. 8, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package and method of manufact... Read More