India, Aug. 5 -- The Telecom Regulatory Authority of India (TRAI) has released a consultation paper proposing amendments to the telecom regulator's existing quality of service (QoS) framework for wire... Read More
India, Aug. 5 -- Ericsson has appointed Randeep Raina as Head of its Customer Unit for Vodafone Idea (Vi), as the telecom equipment maker continues its engagement with the operator on network developm... Read More
India, Aug. 5 -- Xiaomi is officially launching the Redmi Note 17 5G in India on August 6 at 12 noon, positioning it as a battery-first smartphone. The entire narrative around the Redmi Note 17 5G rev... Read More
India, Aug. 5 -- IIT Bhubaneswar has officially signed a five-year Memorandum of Understanding (MoU) with Banashree Semiconductors to advance research, innovation, and talent development in next-gener... Read More
Bangladesh, Aug. 5 -- The flights between Riyadh and Mumbai commenced on August 4. The airline operates the daily service with its Boeing 787-9 Dreamliners, offering Economy, Business, and Business El... Read More
Bangladesh, Aug. 5 -- The promotional offer is valid for bookings made between July 31 and August 15, with the travel period spanning from July 31 to December 31. The discount applies across the natio... Read More
Bangladesh, Aug. 5 -- In an official announcement on August 5, the Indian national airline said Gebremariam will succeed Campbell Wilson, who led Air India through its initial turnaround following its... Read More
India, Aug. 5 -- Six months after SK hynix partnered with SanDisk to drive High Bandwidth Flash (HBF) standardization, the consortium has reached a key milestone by unveiling the first HBF standard sp... Read More
India, Aug. 5 -- Samsung has showcased its latest AI memory innovations at Future of Memory and Storage (FMS) 2026 in Santa Clara, California, USA. With broad expertise spanning DRAM, NAND, enterpris... Read More
India, Aug. 5 -- With TSMC's CoWoS (Chip-on-Wafer-on-Substrate) capacity under pressure, the foundry leader is reportedly developing an advanced packaging solution similar to Intel's Embedded Multi-di... Read More