India, Aug. 5 -- With TSMC's CoWoS (Chip-on-Wafer-on-Substrate) capacity under pressure, the foundry leader is reportedly developing an advanced packaging solution similar to Intel's Embedded Multi-die Interconnect Bridge (EMIB). Citing The Information, TechPowerUp reports that the technology, internally dubbed "EMIB-like," is being developed to prevent potential customer shifts from CoWoS to Intel's packaging platform.

Taiwan-based IC substrate maker Kinsus is expected to support the effort, helping scale the new architecture from development through volume production, the reports add.

As highlighted by TechPowerUp, Intel's EMIB embeds a silicon bridge directly into the package substrate to deliver localized, high-density die-to-die in...