US Patent Issued to Murata Manufacturing on April 14 for "Radio frequency module and communication device" (Japanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,780, issued on April 14, was assigned to Murata Manufacturing Co. Ltd. (Kyoto, Japan). "Radio frequency module and communication device" w... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on April 14 for "Package structure including guiding patterns" (Taiwanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,781, issued on April 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Package structure including guidi... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on April 14 for "Package structure including guiding patterns" (Taiwanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,781, issued on April 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Package structure including guidi... Read More

US Patent Issued to Daktronics on April 14 for "Molded contrast mask for display module" (South Dakota Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,782, issued on April 14, was assigned to Daktronics Inc. (Brookings, S.D.). "Molded contrast mask for display module" was invented by Ryan... Read More

US Patent Issued to Daktronics on April 14 for "Molded contrast mask for display module" (South Dakota Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,782, issued on April 14, was assigned to Daktronics Inc. (Brookings, S.D.). "Molded contrast mask for display module" was invented by Ryan... Read More

US Patent Issued to MACRONIX International on April 14 for "Semiconductor device including a hybrid bonding structure" (Taiwanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,783, issued on April 14, was assigned to MACRONIX International Co. Ltd. (Hsinchu, Taiwan). "Semiconductor device including a hybrid bondi... Read More

US Patent Issued to MACRONIX International on April 14 for "Semiconductor device including a hybrid bonding structure" (Taiwanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,783, issued on April 14, was assigned to MACRONIX International Co. Ltd. (Hsinchu, Taiwan). "Semiconductor device including a hybrid bondi... Read More

US Patent Issued to SK hynix on April 14 for "Stack packages and methods of manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,784, issued on April 14, was assigned to SK hynix Inc. (Icheon-si, South Korea). "Stack packages and methods of manufacturing the same" wa... Read More

US Patent Issued to SK hynix on April 14 for "Stack packages and methods of manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,784, issued on April 14, was assigned to SK hynix Inc. (Icheon-si, South Korea). "Stack packages and methods of manufacturing the same" wa... Read More

US Patent Issued to POWERTECH TECHNOLOGY on April 14 for "Package structure and manufacturing method thereof" (Taiwanese Inventor)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,785, issued on April 14, was assigned to POWERTECH TECHNOLOGY INC. (Hsinchu County, Taiwan). "Package structure and manufacturing method t... Read More

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