US Patent Issued to Taiwan Semiconductor Manufacturing on April 14 for "Package structure including guiding patterns" (Taiwanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,781, issued on April 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Package structure including guiding patterns" was invented by Chen-Hsuan Tsai (Taitung, Taiwan), Chin-Chuan Chang (Hsinchu County, Taiwan) and Ying-Ching Shih (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure including a wiring substrate, semiconductor dies, and a dielectric layer is provided. The wiring substrate includes die bonding regions and guiding patterns (auxiliary patterns, or dummy patterns) distributed between the die bonding regions. The semiconductor dies are disposed on the die bonding regions and...