US Patent Issued to Taiwan Semiconductor Manufacturing on May 26 for "Package formation using UBM-first approach and the corresponding packages" (Taiwanese Inventor)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,642,149, issued on May 26, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Package formation using UBM-first app... और पढ़ें

US Patent Issued to ACTRON TECHNOLOGY on May 26 for "Power semiconductor package signal connection component and semiconductor module" (Taiwanese Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,642,150, issued on May 26, was assigned to ACTRON TECHNOLOGY Corp. (Taoyuan City, Taiwan). "Power semiconductor package signal connection compon... और पढ़ें

US Patent Issued to SAMSUNG ELECTRONICS on May 26 for "Semiconductor package and method of manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,642,151, issued on May 26, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package and method of manufactur... और पढ़ें

US Patent Issued to Infineon Technologies on May 26 for "Power semiconductor module arrangement and method for producing a power semiconductor module arrangement" (German, Austrian Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,642,152, issued on May 26, was assigned to Infineon Technologies AG (Neubiberg, Germany). "Power semiconductor module arrangement and method for... और पढ़ें

US Patent Issued to SEMICONDUCTOR COMPONENTS INDUSTRIES on May 26 for "Discrete dual pads for a circuit" (Chinese, American Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,642,153, issued on May 26, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.). "Discrete dual pads for a circuit" was i... और पढ़ें

US Patent Issued to Tokyo Electron on May 26 for "Methods and devices for improving bond strength of diffusion barriers" (American, Japanese Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,642,154, issued on May 26, was assigned to Tokyo Electron Ltd. (Tokyo). "Methods and devices for improving bond strength of diffusion barriers" ... और पढ़ें

Diversity, trust anchor Canada-India economic ties, says Piyush Goyal in Toronto

Toronto, May 26 -- Union Commerce and Industry Minister Piyush Goyal on Tuesday said "diversity defines the Canada-India partnership," telling business leaders in Toronto that deep trust between the t... और पढ़ें

US Patent Issued to SK On on May 26 for "Battery cell including cooling member" (South Korean Inventor)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,640,418, issued on May 26, was assigned to SK On Co. Ltd. (Seoul, South Korea). "Battery cell including cooling member" was invented by Min Seon... और पढ़ें

US Patent Issued to SBTL ADVANCED MATERIALS on May 26 for "Aluminum pouch film for secondary battery, and method for manufacturing same" (South Korean Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,640,420, issued on May 26, was assigned to SBTL ADVANCED MATERIALS Co. LTD. (Hwaseong-si, South Korea). "Aluminum pouch film for secondary batte... और पढ़ें

US Patent Issued to PRIME PLANET ENERGY & SOLUTIONS on May 26 for "Power storage device and producing method therefor" (Japanese Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,640,421, issued on May 26, was assigned to PRIME PLANET ENERGY & SOLUTIONS INC. (Tokyo). "Power storage device and producing method therefor" wa... और पढ़ें

• ««
• «
• 136304
• 136305
• 136306
• 136307
• 136308
• 136309
• 136310
• 136311
• 136312
• 136313
• »
• »»