US Patent Issued to SAMSUNG ELECTRONICS on May 26 for "Semiconductor package and method of manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,642,151, issued on May 26, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package and method of manufacturing the same" was invented by Seungwan Shin (Suwon-si, South Korea), Junghoon Kang (Suwon-si, South Korea), Byungmin Yu (Suwon-si, South Korea) and Jung Hyun Lee (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes: a first redistribution substrate; a semiconductor chip provided on the first redistribution substrate; a molding material molding the semiconductor chip and the first redistribution substrate; and a second redistribution substrate provided on the moldi...