US Patent Issued to Taiwan Semiconductor Manufacturing on May 26 for "Package formation using UBM-first approach and the corresponding packages" (Taiwanese Inventor)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,642,149, issued on May 26, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Package formation using UBM-first approach and the corresponding packages" was invented by Tzuan-Horng Liu (Longtan Township, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes forming a reconstructed wafer including forming an Under-Bump Metallurgy (UBM) over a first carrier, forming a first interconnect structure including a plurality of redistribution lines over and electrically connecting to the UBM, bonding a first die over the first interconnect structure, encapsulating the first die in a first encapsulant, forming a secon...