US Patent Issued to Ushio Denki on Sept. 1 for "Optical heating device" (Japanese Inventor)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,424, issued on Sept. 1, was assigned to Ushio Denki K.K. (Tokyo). "Optical heating device" was invented by Shinji Taniguchi (Tokyo). Accor... Read More

US Patent Issued to SAMSUNG ELECTRONICS on Sept. 1 for "Chip pick-up head, and chip detachment apparatus and method using the pick-up head" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,425, issued on Sept. 1, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Chip pick-up head, and chip detachment appar... Read More

US Patent Issued to SHIN-ETSU CHEMICAL on Sept. 1 for "Microstructure-transfer stamp component" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,426, issued on Sept. 1, was assigned to SHIN-ETSU CHEMICAL Co. LTD. (Tokyo). "Microstructure-transfer stamp component" was invented by Hide... Read More

US Patent Issued to Applied Materials on Sept. 1 for "Substrate support device with diagnostic capabilities" (Indian, American Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,427, issued on Sept. 1, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Substrate support device with diagnostic capabilitie... Read More

US Patent Issued to NANYA TECHNOLOGY on Sept. 1 for "Wafer container, top cover thereof, and method for managing wafer containers" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,428, issued on Sept. 1, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Wafer container, top cover thereof, and method f... Read More

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Sept. 1 for "Calibration pod for robotic wafer carrier handling and calibration performed using same" (Taiwanese Inventor)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,429, issued on Sept. 1, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Calibration pod for robotic waf... Read More

US Patent Issued to Applied Materials on Sept. 1 for "Semiconductor process equipment" (Indian, American, German Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,430, issued on Sept. 1, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Semiconductor process equipment" was invented by Bha... Read More

US Patent Issued to MIRLE AUTOMATION on Sept. 1 for "Overhead hoist transfer system, overhead hoist transfer, moving kit" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,431, issued on Sept. 1, was assigned to MIRLE AUTOMATION Corp. (Hsinchu, Taiwan). "Overhead hoist transfer system, overhead hoist transfer,... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 1 for "Semiconductor device, method and tool of manufacture" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,432, issued on Sept. 1, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor device, method and to... Read More

US Patent Issued to Applied Materials on Sept. 1 for "Modeling substrate temperatures" (California Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,433, issued on Sept. 1, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Modeling substrate temperatures" was invented by Alv... Read More

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