US Patent Issued to NITTO DENKO on April 21 for "Method for producing wiring circuit board and wiring circuit board" (Japanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,459, issued on April 21, was assigned to NITTO DENKO Corp. (Osaka, Japan). "Method for producing wiring circuit board and wiring circuit b... Read More

US Patent Issued to GE PRECISION HEALTHCARE on April 21 for "Oil-air electrical feedthrough circuit board for high voltage generator" (French Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,460, issued on April 21, was assigned to GE PRECISION HEALTHCARE LLC (Waukesha, Wis.). "Oil-air electrical feedthrough circuit board for h... Read More

US Patent Issued to TOKUYAMA on April 21 for "Laminate for circuit board" (Japanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,461, issued on April 21, was assigned to TOKUYAMA Corp. (Shunan, Japan). "Laminate for circuit board" was invented by Eiki Tsushima (Chito... Read More

US Patent Issued to SAMSUNG ELECTRO-MECHANICS on April 21 for "Printed circuit board and method of manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,462, issued on April 21, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea). "Printed circuit board and method of ... Read More

US Patent Issued to Mitsubishi Materials on April 21 for "Copper base substrate comprising an insulating layer having a specific relationship between thickness and elastic modulus" (Japanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,463, issued on April 21, was assigned to Mitsubishi Materials Corp. (Tokyo). "Copper base substrate comprising an insulating layer having ... Read More

US Patent Issued to Micron Technology on April 21 for "PCB land pad for three-pin MOSFET component" (Idaho Inventor)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,464, issued on April 21, was assigned to Micron Technology Inc. (Boise, Idaho). "PCB land pad for three-pin MOSFET component" was invented... Read More

US Patent Issued to SHINKO ELECTRIC INDUSTRIES on April 21 for "Wiring board" (Japanese Inventor)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,465, issued on April 21, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD. (Nagano, Japan). "Wiring board" was invented by Hiroshi Yokot... Read More

US Patent Issued to Advanced Semiconductor Engineering on April 21 for "Circuit structure" (Taiwanese Inventor)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,466, issued on April 21, was assigned to Advanced Semiconductor Engineering Inc. (Kaohsiung, Taiwan). "Circuit structure" was invented by ... Read More

US Patent Issued to TAIWAN ALPHA ELECTRONIC on April 21 for "Spliced pressure sensing device and splicable pressure sensing unit thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,467, issued on April 21, was assigned to TAIWAN ALPHA ELECTRONIC Co. LTD. (Taoyuan City, Taiwan). "Spliced pressure sensing device and spl... Read More

US Patent Issued to Samsung SDI on April 21 for "Hybrid circuit board and battery pack having same" (South Korean Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,468, issued on April 21, was assigned to Samsung SDI Co. Ltd. (Yongin-si, South Korea). "Hybrid circuit board and battery pack having same... Read More

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