US Patent Issued to Intel on April 14 for "Package structures with non-uniform interconnect features" (Arizona Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,754, issued on April 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Package structures with non-uniform interconnect features" wa... Read More

US Patent Issued to Intel on April 14 for "Package structures with non-uniform interconnect features" (Arizona Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,754, issued on April 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Package structures with non-uniform interconnect features" wa... Read More

US Patent Issued to Micron Technology on April 14 for "Semiconductor device interconnects formed through volumetric expansion" (Idaho Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,755, issued on April 14, was assigned to Micron Technology Inc. (Boise, Idaho). "Semiconductor device interconnects formed through volumet... Read More

US Patent Issued to Micron Technology on April 14 for "Semiconductor device interconnects formed through volumetric expansion" (Idaho Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,755, issued on April 14, was assigned to Micron Technology Inc. (Boise, Idaho). "Semiconductor device interconnects formed through volumet... Read More

US Patent Issued on April 14 for "Method for manufacturing semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,756, issued on April 14. "Method for manufacturing semiconductor device" was invented by Hiroaki Matsubara (Tokyo), Daisuke Ikeda (Tokyo),... Read More

US Patent Issued on April 14 for "Method for manufacturing semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,756, issued on April 14. "Method for manufacturing semiconductor device" was invented by Hiroaki Matsubara (Tokyo), Daisuke Ikeda (Tokyo),... Read More

US Patent Issued to SAMSUNG ELECTRONICS on April 14 for "Semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,757, issued on April 14, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-Si, South Korea). "Semiconductor package" was invented by Bo ... Read More

US Patent Issued to SAMSUNG ELECTRONICS on April 14 for "Semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,757, issued on April 14, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-Si, South Korea). "Semiconductor package" was invented by Bo ... Read More

US Patent Issued to Huawei Technologies'Co., 'Ltd.' on April 14 for "Chip packaging apparatus and preparation method thereof" (Chinese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,758, issued on April 14, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China). "Chip packaging apparatus and preparation method... Read More

US Patent Issued to Huawei Technologies'Co., 'Ltd.' on April 14 for "Chip packaging apparatus and preparation method thereof" (Chinese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,758, issued on April 14, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China). "Chip packaging apparatus and preparation method... Read More

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