US Patent Issued to Intel on April 14 for "Package structures with non-uniform interconnect features" (Arizona Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,754, issued on April 14, was assigned to Intel Corp. (Santa Clara, Calif.).

"Package structures with non-uniform interconnect features" was invented by Zhaozhi Li (Chandler, Ariz.), Feras Eid (Chandler, Ariz.), Michael Baker (Gilbert, Ariz.), Wenhao Li (Chandler, Ariz.), Pilin Liu (Chandler, Ariz.) and Johanna Swan (Scottsdale, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Microelectronic die package structures formed according to some embodiments may include a substrate having one or more solder structures. A first set of solder structures is located in a peripheral region of the substrate and a second set of solder structures is located in...